According to Dealsite, South Korean memory manufacturer SK Hynix is expected to start purchasing next-generation HBM4 12-layer stacking equipment as early as the end of this month. However, the investment review meeting has been postponed, and the overall schedule will be slightly delayed.
According to the industry, SK Hynix was originally scheduled to hold an investment review committee in October, but it was postponed to the end of November to early December due to continuous vacations and group personnel adjustments. Equipment issuance is expected to begin after the meeting.
Although there were previous differences with NVIDIA on the price and technical specifications of HBM4, the two parties have recently completed a supply agreement, and the relevant uncertainties have gradually been lifted. As market demand becomes clear, SK Hynix has also accelerated its investment planning internally. However, against the backdrop of SK Group Chairman Choi Tae-won emphasizing "operational improvement (O/I)" and efficiency reform, the actual investment timing remains prudent.
According to sources in the semiconductor industry, the HBM4 currently supplied by SK Hynix to NVIDIA is still produced using modified HBM3E 12-layer equipment. Although this method can quickly respond to demand, it results in a longer lead time and reduced strain capacity. Since formal equipment introduction must be completed early next year, failure to issue orders within the year may affect the stability of the mass production line. Therefore, the company plans to start purchasing some equipment before the end of the year to ensure a smooth start of production early next year.
SK Hynix has used existing equipment to complete the delivery of HBM4 samples for testing in March this year, and will start small-scale mass production within one quarter. In the official statement issued in September, the company also emphasized that "the HBM4 mass production system has been established", reflecting that the current stage is still in the "transitional mass production" stage.
Currently, the new M15X factory in Cheongju is undergoing infrastructure construction. Although the first clean room has been opened, the imported equipment is mainly for infrastructure purposes and is not directly used in the HBM4 process. Since the power supply conditions of the plant still need to be coordinated by the local government, and it usually takes 1 to 2 months from the issuance of the equipment order to the arrival of the equipment, the industry expects that HBM4 special equipment will officially enter the site early next year.
Industry insiders pointed out that SK Hynix’s internal investment review meeting will be held as soon as the end of November. Once the investment direction is confirmed, partner manufacturers will be notified and the delivery date will be adjusted. Although the overall atmosphere of personnel reform in the group is high, SK hynix is expected to maintain the current structure to steadily promote investment in new generation products, relying on the high profit performance driven by HBM.
On the other hand, Samsung Electronics is also making every effort to accelerate its mass production preparations for HBM4. It has recently completed the introduction and testing of new equipment at the Pyeongtaek Park and continues to improve yield performance. The industry expects that Samsung will start stable shipments next year and compete with SK Hynix for dominance in HBM4 mass production progress and quality performance.
SK하이닉스, 이달부터 HBM4 장비 발주…’투심위’ 임박 Further reading: After 30 years, SK Hynix’s general-purpose DRAM operating profit margin may exceed 70% SK Hynix's bid for NVIDIA's HBM4 surges by 50%, Micron's stock price soars