As demand for generative artificial intelligence continues to rise, Japanese electronic components manufacturer Ibiden will significantly expand IC packaging substrates. The company plans to increase substrate production (calculated in packaging) by 2027 by 2027, with the new production line of Ono Factory in Gifu Prefecture as soon as next month.
Ibiden is the world's leading supplier of IC packaging substrates, with customers covering Intel, AMD, Samsung Electronics, TECHNOLOGY and NVIDIA. As AI servers double the demand for high-level packaging, the company is investing heavily and planning to concentrate PC-related product production to the Philippines to improve resource allocation efficiency.
According to daily reports, the company's goal is to increase its electronics sales to 38 billion yen (about NT$76 billion) for the year ended at the end of March 2028, a 93% increase over 2025, and it mainly comes from generative AI server-related products.
According to the second quarter of 2025 financial report released on August 1, although PC and general server demand is lower than expected, the orders for high-added value products related to generative AI have significantly exceeded the standards, coupled with the increase in production, pushing the overall industry beyond the plan. The company therefore revised its annual financial survey and increased the combined acquisition target from 41 million NT$82 billion (about NT$82 billion) to 415 billion NT$83 billion).
(Source: Ibiden )
Ibiden's share price closed at 9,026 yen (about NT$1,843), up 479 yen, up 5.6%. The plate was once exposed to 9,175 yen (about NT$1,835).
Nvidia supplier Ibiden to expand IC substrate output amid AI boom